September 30, 2025
Free Form Fibers has continued to build its IP portfolio over the last several months. Multiple patents have been awarded to the company by the U.S. and Canadian patent offices that cover technologies for next-generation semiconductor substrates, ceramic composite fabrication, nuclear cladding, and sensors. These patents are listed below:
High Purity Fiber Feedstock for Loose Grain Production, US Patent #12,312,682
High Purity Ingot for Wafer Production, US Patent #12,415,763
Fiber Structures with Embedded Sensors, US Patent #12,241,160
Non-Woven Micro-Trellis Fabrics and Composite or Hybrid-Composite Materials Reinforced Therewith, Canadian Patent #CN114727882