Patent Award: Radially Graded Fully Dense Inorganic Filaments For Enhanced Strength and Creep Resistance

News: Patent Award

April 30, 2021

Free Form Fibers has been granted Japanese patent # 6877518 B2 for the fabrication of a fiber with a composite microstructure that leads to improved material properties such as mechanical behavior and creep performance at elevated temperatures.

This patent subject has previously been granted in the U.S.